Naina Qayyam ’15 was recently named one of 129 new Schwarzman Scholars! The second class of Schwarzman Scholars is composed of students from 30 countries and 75 universities with 45% from the United States, 20% from China, and 35% from the rest of the world. Schwarzman Scholars is quickly becoming the premier training ground for future leaders, educating and preparing the world’s most exceptional men and women to confront the most difficult challenges of the coming century and develop an understanding of China necessary to lead in the future. This fully-funded Master’s degree program, founded by Blackstone Chairman, CEO and Co-Founder Stephen A. Schwarzman, is housed at Tsinghua University in Beijing, one of China’s premier institutions. To learn more about Schwarzman Scholars, see www.schwarzmanscholars.org . Congratulations, Naina!
Congratulations to Hasher Nisar, Middlebury’s newest Marshall Scholar! The scholarship will support Hasher’s graduate study of Islamic Studies at Oxford University. Read more about Hasher and the Marshall scholarship at http://www.middlebury.edu/newsroom/around-campus/node/543269
The Harvard College Undergraduate Research Association presents. . . .The 2017 National Collegiate Research Conference, January 19-21, 2017 | Harvard University
Interested in research, collaboration, and innovation? Want to present your research at Harvard, receive feedback, and win prizes? Interested in meeting some of the most talented undergraduate students in the world?
Join 200 of the top undergraduate researchers from around the country and the globe for the 2017 National Collegiate Research Conference, the largest student-run undergraduate research conference in America.
Those interested in research from all academic disciplines (i.e. humanities, social sciences, life sciences, physical sciences) are encouraged to apply.
Application Deadline *Extended*: Friday, 2 December 2016 (11:59 pm EST)
See http://www.ncrc.hcura.org/ for more information and application instructions!
Harvard University is one of ten U.S. institutions that again will be offering a ten-week Amgen Scholars Program in the summer of 2017.
The Harvard-Amgen program, with an emphasis on biotechnology research, affords a diverse cohort of rising undergraduate juniors and seniors the opportunity to work in the laboratories of faculty across the Harvard universe, including the Wyss Institute for Biologically Inspired Engineering, the Broad Institute of MIT and Harvard, the Harvard School of Engineering and Applied Sciences, and the Division of Medical Sciences at Harvard Medical School. In addition to an engaging, formative research experience, Harvard-Amgen Scholars will live among the 400 undergraduates residents of the Harvard Summer Undergraduate Research Village community in one of the historic Houses along the Charles River.
The deadline to submit complete applications is Monday, February 1, 2017.
More information about the Harvard-Amgen Scholars Program, including profiles of last years cohort, along with eligibility criteria and instructions to apply may be found at uraf.harvard.edu/amgen-scholars.
The Amgen Scholars Program website, which includes information about all of the U.S. and international programs available this coming summer may be found at www.amgenscholars.com.
University of Utah Materials Research Science & Engineering Center (MRSEC) Next-Generation Materials for Plasmonics & Organic Spintronics in Salt Lake City, Utah
Research Experience for Undergraduates (REU)
June 5 – August 4, 2017
$5000 stipend, travel allowance and campus housing
Potential majors: physics, chemistry, materials science, engineering (chemical, electrical, mechanical, metallurgical), applied math.
Apply online by February 12, 2017 at: www.mrsec.utah.edu/reu
Open to U.S. citizens & permanent residents obtaining an undergraduate degree December 2017 or after. Women & minority students are especially encouraged to apply. Students from non-research institutions may be given priority. Supported by the National Science Foundation under grant no. DMR-1121252 CFDA NO. 47.049